Electronic Components, Prototyping Materials, and 3D Printing Services for Indian Army Procurement

Work Description - NA

This tender, with Bid Number GEM/2026/B/7881239, is issued by the Department of Military Affairs, under the Ministry of Defence, for and on behalf of the Indian Army, based out of Jalpaiguri. The tender seeks proposals for a comprehensive range of electronic components and prototyping materials, including Stand SPDT Slide Switches, Arduino Nano, USB Cables, Raspberry Pi, Raspberry Pi Cameras, and associated FPC cables. Furthermore, the scope extends to the design and 3D printing of Push-Pull Rods and Couplers, along with essential consumables like Cable Ties and Spiral Wrapping Sleeves. The requirement also encompasses Thermoplastic Module Components, Boards with Micro USB, ESP (likely referring to ESP32 or similar development boards), ESP 3 Mini Boards, AC to DC converters, and materials for 3D Imagine Printing, Batteries, Motors, and Electronic Speed Controllers (ESCs). A total quantity of 133 units across these varied items is specified. The bidding period commences on 05-08-2026 at 7:08 PM and concludes on 17-08-2026 at 7:00 PM.