| Tender Title | Procurement of Printed Circuit Board Assemblies for Defence Applications | ||
| Tender ID | GEM/2026/B/7786318 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-07-14 04:23 PM | Tender Closing Date | 2026-08-12 09:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Hyderabad , Telangana |
| Tender Category | Product Category | Electrical and Electronics Tenders, Electronics Equipment Tenders | |
| ePublished Date | 2026-07-14 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-07-14 04:23 PM | Bid Submission End Date | 2026-08-12 09:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Work Description - NA
This tender announcement, issued by the Department of Defence Production under the Ministry of Defence, concerns the procurement of PCB Assemblies. Hindustan Aeronautics Limited (HAL) is the organization responsible, with the bid number GEM/2026/B/7786318. The tender period commences on July 14, 2026, at 4:23 PM and concludes on August 12, 2026, at 9:00 PM. The Bill of Quantities (BOQ) title is "PCB ASSEMBLIES," and the total quantity required is 144 units. The specific item categories covered by this tender are GS3.031.144-1, GS3.031.146-1, GS3.035.058-01-1, KZHIS.301413.088-1, KZHIS.301413.089-1, KZHIS.434774.036-1, KZHIS.468729.003-1, and KZHIS.467444.018-01-1. The procurement will be managed by HAL, with administrative details pertaining to an office located in Rangareddi.

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| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
For Complete Deion And Other Details, Please Refer To Tender..read more
For Complete Deion And Other Details, Please Refer To Tender..read more
For Complete Deion And Other Details, Please Refer To Tender..read more
For Complete Deion And Other Details, Please Refer To Tender..read more
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