High-Precision Module Enclosure Assembly and Supply
- Opening DateJun 25, 2026
- Closing DateJul 16, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | High-Precision Module Enclosure Assembly and Supply | ||
| Tender ID | NA | Tender Reference Number | HSS-P-2400-2520 |
| Tender Type | National Competitive Bid | ||
| Tender Opening Date | 2026-06-25 08:42 AM | Tender Closing Date | 2026-07-16 09:30 AM |
| Tender Value | Refer Document | Tender Location | Hyderabad , Hyderabad , Telangana |
| Tender Category | Goods | Product Category | Machinery and Tools Tenders |
- Tender TitleHigh-Precision Module Enclosure Assembly and Supply
- Tender IDNA
- Tender Reference NumberHSS-P-2400-2520
- Tender TypeNational Competitive Bid
- Tender Opening Date2026-06-25 08:42 AM
- Tender Closing Date2026-07-16 09:30 AM
- Tender Value Refer Document
- Tender LocationHyderabad,Hyderabad, Telangana
- Tender CategoryGoods
- Product CategoryMachinery and Tools Tenders
Important Dates
| ePublished Date | 2026-06-25 08:42 AM | Bid Opening Date | 2026-07-16 10:00 AM |
| Document Download Start Date | 2026-06-25 08:42 AM | Document Download End Date | 2026-07-16 09:30 AM |
| Bid Submission Start Date | 2026-06-25 08:42 AM | Bid Submission End Date | 2026-07-16 09:30 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-06-25 08:42 AM
- Bid Opening Date2026-07-16 10:00 AM
- Document Download Start Date2026-06-25 08:42 AM
- Document Download End Date2026-07-16 09:30 AM
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-06-25 08:42 AM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - Supply Of Module Enclosure Assembly (blanking, Punching, Riveting And Metal Finish Etc.) Including Material As Per Drawings List Attached At Annexure-a (drawings Attached Separately)
Electronics Corporation of India Limited (ECIL), a Public Sector Undertaking, invites bids for a National Competitive Bid tender titled "Supply of Module Enclosure assembly (Blanking, Punching, Riveting and Metal finish etc.) including material as per drawings list attached at Annexure-A (Drawings attached separately)". This tender, referenced as HSS-P-2400-2520, falls under the Goods category, specifically Electrical Goods/Equipment, for the supply of Module Enclosure assembly, to be delivered in Hyderabad. Interested bidders can download documents from 25-Jun-2026 02:12 PM until 16-Jul-2026 03:00 PM. Bid submission commences on 25-Jun-2026 02:12 PM and closes on 16-Jul-2026 03:00 PM, with bids scheduled to be opened on 16-Jul-2026 03:30 PM. There is no tender fee or EMD required for this opportunity. For further details, please contact P ASHOK KUMAR at ECIL Hyderabad.
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Tender Contact Details
| Office Inviting Bids | P Ashok Kumar |
| Address | Ecil Hyderabad |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
- Document Not Available
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