Custom Semiconductor Wafer Bonder Setup with Optical Inspection for Defence R&D
Goods
Electrical and Electronics
+ 2
Electronics Equipment
Machinery and Tools
- Opening DateJul 28, 2026
- Closing DateAug 08, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Custom Semiconductor Wafer Bonder Setup with Optical Inspection for Defence R&D | ||
| Tender ID | GEM/2026/B/7839477 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-07-28 11:33 AM | Tender Closing Date | 2026-08-08 09:00 AM |
| Tender Value | Refer Document | Tender Location | NA , Central Delhi , Delhi |
| Tender Category | Goods | Product Category | Electrical and Electronics Tenders, Electronics Equipment Tenders, Machinery and Tools Tenders |
Tender Overview
- Tender TitleCustom Semiconductor Wafer Bonder Setup with Optical Inspection for Defence R&D
- Tender IDGEM/2026/B/7839477
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-07-28 11:33 AM
- Tender Closing Date2026-08-08 09:00 AM
- Tender Value Refer Document
- Tender LocationNA,Central Delhi, Delhi
- Tender CategoryGoods
- Product CategoryElectrical and Electronics Tenders, Electronics Equipment Tenders, Machinery and Tools Tenders
Important Dates
| ePublished Date | 2026-07-28 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-07-28 11:33 AM | Bid Submission End Date | 2026-08-08 09:00 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
Important Dates
- ePublished Date 2026-07-28 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-07-28 11:33 AM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender, identified by Bid Number GEM/2026/B/7839477, is issued by the Office Of Dg (Med Cos) within the Department Of Defence Research Development, under the Ministry Of Defence. The procurement opportunity, dated 28-07-2026, is open for bidding from 28-07-2026 at 11:33 AM until 08-08-2026 at 9:00 AM. The essential requirement is for the supply of two (2) units of a Customized Semiconductor Wafer Bonder Setup, which must include an Optical Inspection Unit featuring a Universal Zoom Head and a Tilting Frame. This specialized equipment is critical for advanced research and development activities within the defence sector, necessitating high precision and customizability in its configuration.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
Document
page0001_-10_2026-07-27-14-45-21_d86e34defd7b54e88c5a29c995daa2d0.pdfDocument
page0001_-10_2026-07-27-14-43-38_cf0162b92ed173de1f9fbfea09f02b50.pdfDocument
GeM-Bidding-9666993.pdfDocument
semi_828f71d9-5df2-481b-9e1d1785144649599_buycon2.odmc.dl@gembuyer.in.pdf
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