Acquisition of Advanced Flip Chip Bonder for Defence Research
- Opening DateJul 31, 2026
- Closing DateAug 11, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Acquisition of Advanced Flip Chip Bonder for Defence Research | ||
| Tender ID | GEM/2026/B/7856531 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-07-31 04:01 PM | Tender Closing Date | 2026-08-11 10:00 AM |
| Tender Value | Refer Document | Tender Location | NA , Central Delhi , Delhi |
| Tender Category | Goods | Product Category | Machinery and Tools Tenders |
- Tender TitleAcquisition of Advanced Flip Chip Bonder for Defence Research
- Tender IDGEM/2026/B/7856531
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-07-31 04:01 PM
- Tender Closing Date2026-08-11 10:00 AM
- Tender Value Refer Document
- Tender LocationNA,Central Delhi, Delhi
- Tender CategoryGoods
- Product CategoryMachinery and Tools Tenders
Important Dates
| ePublished Date | 2026-07-31 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-07-31 04:01 PM | Bid Submission End Date | 2026-08-11 10:00 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-07-31 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-07-31 04:01 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender, identified by Bid Number GEM/2026/B/7856531, is being issued by the Department of Defence Research and Development, under the Ministry of Defence. The relevant authority for this procurement is the Office of Dg (Med Cos). The tender pertains to the acquisition of a single unit of a Flip Chip Bonder, a critical piece of equipment within the Item Category. Interested parties are advised that the bid submission period commences on 31-07-2026 at 4:01 PM and concludes on 11-08-2026 at 10:00 AM. This opportunity represents a direct procurement need for advanced technological capabilities within the defence research sector, requiring suppliers to demonstrate expertise and provide high-quality equipment to meet the stringent requirements of the Ministry of Defence.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
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