Indian Institute Of Technology Tender

Work Description - Semi-automatic Wire Bonder

The Indian Institute of Technology Madras, a Central Government Ministry/Department organization, invites global tenders for the supply of a SEMI-AUTOMATIC WIRE BONDER, as detailed in Tender Reference Number IITM/SPS/WIRE BONDER/GTE/017. This tender, categorized as 'Goods,' requires bidders to submit proposals in two covers: one for Fee/PreQual/Technical documentation (PDF format) and another for Financial details (BOQ in XLS format). The Earnest Money Deposit (EMD) is fixed at ₹1,35,000, payable offline to "The Registrar, IIT Madras" at IIT Madras. Exemption from EMD is allowed under specified conditions. Key dates include the ePublished Date of December 10, 2025, Document Download starting December 10, 2025, and ending January 8, 2026. The Bid Submission period runs from December 23, 2025, to January 8, 2026, with the Bid Opening scheduled for January 9, 2026. A Pre-Bid Meeting is scheduled for December 18, 2025, via Google Meet. The work, to be completed within 70 days, will be performed at IIT Madras, Pincode 600036, and bids must remain valid for 120 days. Tender documents, including the NIT and work item details are available for download. Interested parties should address inquiries to The Assistant Registrar, IIT Madras.