Thermal Insulation

  • Opening DateApr 01, 2026
  • Closing DateApr 22, 2026
  • Tender Amount Refer Document

Tender Overview

Tender Title Thermal Insulation
Tender IDGEM/2026/B/7397777Tender Reference NumberNA
Tender TypeNA
Tender Opening Date2026-04-01 03:54 AMTender Closing Date2026-04-22 04:30 AM
Tender Value Refer Document Tender LocationNA , Mohali , Punjab
Tender CategoryGoodsProduct CategoryOthers Tenders
Tender Overview
  • Tender TitleThermal Insulation
  • Tender IDGEM/2026/B/7397777
  • Tender Reference NumberNA
  • Tender TypeNA
  • Tender Opening Date2026-04-01 03:54 AM
  • Tender Closing Date2026-04-22 04:30 AM
  • Tender Value Refer Document
  • Tender LocationNA,Mohali, Punjab
  • Tender CategoryGoods
  • Product CategoryOthers Tenders

Important Dates

ePublished Date 2026-03-31 06:30 PM Bid Opening Date
Document Download Start DateDocument Download End Date
Bid Submission Start Date2026-04-01 03:54 AMBid Submission End Date2026-04-22 04:30 AM
Clarification start DateClarification End Date
Bid Validity Period (in Days)NA
Important Dates
  • ePublished Date 2026-03-31 06:30 PM
  • Bid Opening Date
  • Document Download Start Date
  • Document Download End Date
  • Clarification End Date
  • Clarification End Date
  • Bid Submission Start Date2026-04-01 03:54 AM
  • Bid Validity Period (in Days)NA

Cost Specification

Tender Fee Refer document
EMD (Earnest Money Deposit) Refer document
EMD Fee Type NA
Payment Instruments/Mode NA

Tender Description

Work Description - NA

The Department of Electronics and Information Technology, through the Semiconductor Laboratory, invites qualified bidders to participate in tender number GEM/2026/B/7397777 for the comprehensive supply and associated services of Thermal Insulation. This tender, released on April 1st, 2026, seeks to procure a total quantity of 272 units encompassing the supply of thermal insulation for exhaust pipes, including associated ITC, the supply and ITC of 1-phase 230V Aviation Obstruction Beacons, and the decommissioning and removal of existing damaged insulation. The deadline for bid submission is April 22nd, 2026, at 10:00 AM. Prospective bidders should carefully review the detailed requirements and specifications outlined in the tender documents available under the Ministry of Electronics and Information Technology, ensuring full compliance to effectively contribute to the operational needs of the Semiconductor Laboratory, located in office 160071.

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Tender Contact Details

Office Inviting Bids NA
AddressNA
Contact Details NA
Email NA
Website NA

Documents

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