High Speed PCB Manufacturing and Assembly Services

Work Description - NA

This tender description is for the procurement of High Speed PCBs and associated services, initiated by the Centre For Development Of Advanced Computing (c-dac) under the Department of Electronics and Information Technology, Ministry of Electronics and Information Technology. The bid, identified by Bid Number GEM/2026/B/7782753, is open for application from 10:05 AM on 16-07-2026 until 11:00 AM on 06-08-2026. The scope of the tender encompasses the provision of High Speed PCBs, Bare PCBs, Non-Recurring Engineering (NRE) charges for both PCB manufacturing and assembly, and any other incidental charges required for the complete delivery of the specified items. A total quantity of 29 units is being sought, with the procurement managed by the Office of c-DAC, located at C-DAC Innovation Park, Panchavati, Pashan, with a PIN code of 411008C.