High-Speed PCB Assembly and Manufacturing Services

Work Description - NA

This tender invitation, emanating from the **Department of Electronics and Information Technology**, specifically through the **Centre For Development Of Advanced Computing (c-dac)**, located at **C-DAC Innovation Park, Panchavati, Pashan, 411008C**, concerns the procurement of **High Speed PCBs** as detailed in the Bill of Quantities (BOQ). The tender, with Bid Number **GEM/2026/B/7780904**, is open for application between **16-07-2026 at 10:03 AM** and will close on **06-08-2026 at 11:00 AM**. The authority is seeking proposals for a total quantity of **29 units**, encompassing a broad range of items including **PCBA, Bare PCB, NRE charges, NRE for Assembly, and any other associated charges**. This opportunity, issued on **16-07-2026**, falls under the purview of the **Ministry Of Electronics And Information Technology** and is managed by the **West** office of c-dac, representing a critical procurement for advanced computing infrastructure.