Procurement of Advanced Microprocessor-Based Bus Transfer System Modules for HT Switchgear

Work Description - Procurement Of Advanced Microprocessor Based Spare Bts (bus Transfer System) Module Installed In Ht Switchgear For Unit3 And 4 And Station Switchgear At 2x660mw Sstpp, Stage-ii, Mppgcl, Khandwa, (m.p.).

Madhya Pradesh Power Generating Company Limited (MPPGCL), through its SE (Purchase) SSTPP MPPGCL Dongalia, is inviting bids for the Procurement of advanced microprocessor-based spare BTS (Bus Transfer System) Modules for the HT Switchgear of units 3 and 4, and the Station Switchgear at the 2X660MW SSTPP, Stage-II, located in Khandwa, Madhya Pradesh. This is a Goods category tender with a tender value of ₹1,37,14,000 and is being conducted as a Single Tender type with an Item Wise Form of Contract. The tender documents are available for download from July 28, 2026, 05:00 PM, and the deadline for bid submission is August 17, 2026, 03:30 PM. The bid opening will take place on August 20, 2026, 03:30 PM. A tender fee of ₹1,534 (including 18% GST) is applicable, with no exemption allowed. The EMD amount is ₹0.00, and no EMD exemption is permitted. The tender requires a two-cover bid submission process, with the first cover containing fee, pre-qualification, and technical documents, and the second cover containing the financial bid. Key documents to be submitted within Cover 1 include, but are not limited to, MSE if applicable, GSTIN Certificate, previous order copies for rate justification, various annexures as per the Standard Bidding Document (SBD), an affidavit confirming no banning/blacklisting/delisting, a tender acceptance letter, a checklist, a model certificate of the tenderer, DSC/authorization letter, and an unpriced replica of the price bid. Cover 2 is exclusively for the price bid. The work is expected to be completed within a period of 60 days, and the bid validity period is 180 days. Prospective bidders are advised to refer to the detailed NIT and other associated documents for comprehensive information regarding technical specifications, eligibility criteria, and submission guidelines.