Precision Wirebond Removal Services for BGA Semiconductor Chips
Services
Electrical and Electronics
+ 1
Electronics Equipment
- Opening DateAug 19, 2026
- Closing DateSep 01, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Precision Wirebond Removal Services for BGA Semiconductor Chips | ||
| Tender ID | GEM/2026/B/7936231 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-08-19 02:34 PM | Tender Closing Date | 2026-09-01 03:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Thiruvananthapuram , Kerala |
| Tender Category | Services | Product Category | Electrical and Electronics Tenders, Electronics Equipment Tenders |
Tender Overview
- Tender TitlePrecision Wirebond Removal Services for BGA Semiconductor Chips
- Tender IDGEM/2026/B/7936231
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-08-19 02:34 PM
- Tender Closing Date2026-09-01 03:00 PM
- Tender Value Refer Document
- Tender LocationNA,Thiruvananthapuram, Kerala
- Tender CategoryServices
- Product CategoryElectrical and Electronics Tenders, Electronics Equipment Tenders
Important Dates
| ePublished Date | 2026-08-19 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-08-19 02:34 PM | Bid Submission End Date | 2026-09-01 03:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
Important Dates
- ePublished Date 2026-08-19 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-08-19 02:34 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender opportunity, under Bid Number GEM/2026/B/7936231, is issued by the Centre For Development Of Advanced Computing (C-DAC), an organization operating under the Ministry of Electronics and Information Technology, and specifically by their Thiruvananthapuram office, on behalf of the Department of Electronics and Information Technology. The core requirement for this bid revolves around the specialized service of wirebond removal for BGA packaged semiconductor chips. This critical process, essential for rework, repair, or analysis of microelectronic components, demands precision and expertise. The bid will be open for submission from 19-08-2026 at 2:34 PM and will close on 01-09-2026 at 3:00 PM. Only a single unit of this specialized service is being procured at this time.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
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