16-Layer Printed Circuit Board (PCB) Fabrication Services
- Opening DateJul 30, 2026
- Closing DateAug 14, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | 16-Layer Printed Circuit Board (PCB) Fabrication Services | ||
| Tender ID | GEM/2026/B/7855411 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-07-30 04:02 PM | Tender Closing Date | 2026-08-14 04:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Thiruvananthapuram , Kerala |
| Tender Category | Goods | Product Category | Electronics Equipment Tenders |
Tender Overview
- Tender Title16-Layer Printed Circuit Board (PCB) Fabrication Services
- Tender IDGEM/2026/B/7855411
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-07-30 04:02 PM
- Tender Closing Date2026-08-14 04:00 PM
- Tender Value Refer Document
- Tender LocationNA,Thiruvananthapuram, Kerala
- Tender CategoryGoods
- Product CategoryElectronics Equipment Tenders
Important Dates
| ePublished Date | 2026-07-30 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-07-30 04:02 PM | Bid Submission End Date | 2026-08-14 04:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
Important Dates
- ePublished Date 2026-07-30 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-07-30 04:02 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
The Centre for Development of Advanced Computing (C-DAC), under the Ministry of Electronics and Information Technology and the Department of Electronics and Information Technology, is inviting bids for the fabrication of sixteen-layer Printed Circuit Boards (PCBs). This opportunity, identified by Bid Number GEM/2026/B/7855411, is open for application from July 30, 2026, at 4:02 PM until August 14, 2026, at 4:00 PM. The procurement, to be carried out by the Thiruvananthapuram office, requires the fabrication of a total quantity of two units of these complex PCBs. This tender presents a valuable opportunity for qualified fabrication providers to contribute to advanced electronic component manufacturing.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
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