Procurement of Electronic Assembly and Repair Materials for Military Applications
- Opening DateAug 20, 2026
- Closing DateAug 31, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Procurement of Electronic Assembly and Repair Materials for Military Applications | ||
| Tender ID | GEM/2026/B/7944216 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-08-20 08:19 PM | Tender Closing Date | 2026-08-31 09:00 AM |
| Tender Value | Refer Document | Tender Location | NA , Kangra , Himachal Pradesh |
| Tender Category | Goods | Product Category | Electrical Cables And Wires Tenders, Electrical Goods and Equipments Tenders, Electronics Equipment Tenders |
- Tender TitleProcurement of Electronic Assembly and Repair Materials for Military Applications
- Tender IDGEM/2026/B/7944216
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-08-20 08:19 PM
- Tender Closing Date2026-08-31 09:00 AM
- Tender Value Refer Document
- Tender LocationNA,Kangra, Himachal Pradesh
- Tender CategoryGoods
- Product CategoryElectrical Cables And Wires Tenders, Electrical Goods and Equipments Tenders, Electronics Equipment Tenders
Important Dates
| ePublished Date | 2026-08-20 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-08-20 08:19 PM | Bid Submission End Date | 2026-08-31 09:00 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-08-20 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-08-20 08:19 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender presents a critical opportunity for qualified suppliers to provide essential electronic components and materials to the Department of Military Affairs, under the Ministry of Defence. The procurement, identified by Bid Number GEM/2026/B/7944216, is being managed by the Indian Army and is scheduled to commence on August 20, 2026, at 8:19 PM, concluding on August 31, 2026, at 9:00 AM. The specific items required encompass a comprehensive range of high-quality materials crucial for military electronics assembly and maintenance. These include Soldering Wire in 1.5mm and an unspecified other size, Soldering Paste, Teflon Wire (0.5mm), Insulation Tape, Silicone Tube, Polybags specifically designed for PCB boards, Feviquick adhesive, and Polythene Film (0.25mm) including polarized film for a 12-inch LCD display. The total quantity for this diverse assortment of materials is 582 units. Bidders are encouraged to carefully review the detailed specifications and ensure their offerings meet the stringent requirements of the Department of Military Affairs.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
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