Indian Space Research Organisation Tender
Fabrication And Supply Of Conventional Mlb And High Density Interconnect (hdi) Printed Circuit Boards (pcbs) 18 To 32 Layers
- Opening DateJun 26, 2025
- Closing DateJul 31, 2025
- Tender Amount Refer Document
Tender Overview
| Tender Title | Fabrication And Supply Of Conventional Mlb And High Density Interconnect (hdi) Printed Circuit Boards (pcbs) 18 To 32 Layers | ||
| Tender ID | 2025_ISRO_803201_1 | Tender Reference Number | SAC/CPUR/SA202500113501 |
| Tender Type | Global Tenders | ||
| Tender Opening Date | 2025-06-26 11:00 AM | Tender Closing Date | 2025-07-31 05:00 AM |
| Tender Value | Refer Document | Tender Location | Sac, Ahmedabad , Ahmedabad , Gujarat |
| Tender Category | Goods | Product Category | Electrical and Electronics Tenders, Electronics Equipment Tenders |
- Tender TitleFabrication And Supply Of Conventional Mlb And High Density Interconnect (hdi) Printed Circuit Boards (pcbs) 18 To 32 Layers
- Tender ID2025_ISRO_803201_1
- Tender Reference NumberSAC/CPUR/SA202500113501
- Tender TypeGlobal Tenders
- Tender Opening Date2025-06-26 11:00 AM
- Tender Closing Date2025-07-31 05:00 AM
- Tender Value Refer Document
- Tender LocationSac, Ahmedabad,Ahmedabad, Gujarat
- Tender CategoryGoods
- Product CategoryElectrical and Electronics Tenders, Electronics Equipment Tenders
Important Dates
| ePublished Date | 2025-06-26 11:00 AM | Bid Opening Date | 2025-07-31 09:10 AM |
| Document Download Start Date | 2025-06-26 11:00 AM | Document Download End Date | 2025-07-31 05:00 AM |
| Bid Submission Start Date | 2025-06-26 11:00 AM | Bid Submission End Date | 2025-07-31 05:00 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | 120 |
- ePublished Date 2025-06-26 11:00 AM
- Bid Opening Date2025-07-31 09:10 AM
- Document Download Start Date2025-06-26 11:00 AM
- Document Download End Date2025-07-31 05:00 AM
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2025-06-26 11:00 AM
- Bid Validity Period (in Days)120
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | Fixed |
| Payment Instruments/Mode | Not Applicable |
Tender Description
Work Description - Fabrication And Supply Of Conventional Mlb
 And High Density Interconnect (hdi) Printed Circuit
 Boards (pcbs) 18 To 32 Layers
The Indian Space Research Organisation (ISRO), a Central Government Ministry/Department, invites global tenders for the FABRICATION AND SUPPLY OF CONVENTIONAL MLB AND HIGH DENSITY INTERCONNECT (HDI) PRINTED CIRCUIT BOARDS (PCBs) 18 to 32 layers. The Tender Reference Number is SAC/CPUR/SA202500113501 and the Tender ID is 2025_ISRO_803201_1. Prospective bidders can download tender documents starting from June 26, 2025, at 04:30 PM until July 31, 2025, at 10:30 AM. Bids must be submitted electronically between June 26, 2025, at 04:30 PM and July 31, 2025, at 10:30 AM. A pre-bid meeting will be held online on July 03, 2025, at 11:00 AM. The bid opening date is scheduled for July 31, 2025, at 02:40 PM at SAC, Ahmedabad. This tender is a two-cover system, requiring a techno-commercial bid (Cover 1 - .pdf) and a price bid (Cover 2 - .xls). No EMD or Tender Fee is applicable for this tender. The contract period is 120 days and the bid validity is also 120 days. Further details regarding technical specifications and submission requirements can be found in the tender documents available for download. The Tender Inviting Authority is PSO, located at SAC, Ahmedabad.
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Tender Contact Details
| Office Inviting Bids | Pso |
| Address | Sac, Ahmedabad |
| Contact Details | NA |
| NA | |
| Website | NA |
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