Empanelment Of New Vendors For Rate Contract Of Hi Rel Pcb Wiring And Assembly For Onboard Projects

Work Description - Empanelment Of New Vendors For Rate Contract Of Hi-rel&#x0d Pcb Wiring And Assembly For Onboard Projects

The Indian Space Research Organisation (ISRO), a Central Government Ministry/Department, through its Space Applications Centre (SAC) in Ahmedabad, invites global tenders for the empanelment of new vendors for a Rate Contract of HI-REL PCB wiring and assembly for onboard projects. This tender, referenced as SAC/CPUR/SA202600022601, is categorized under "Goods," specifically "Electronics Equipment." The tender process involves a two-cover system: a Techno-Commercial Bid (Cover 1, .pdf format) and a Price Bid (Cover 2, .xls format). Key dates to note include the ePublished Date and Document Download Start Date, both on May 18, 2026, at 10:00 AM, and the Document Download End Date and Bid Submission End Date on June 15, 2026, at 03:30 PM. The Bid Opening Date is scheduled for June 16, 2026, at 02:00 PM. A Pre-Bid Meeting will be held online on June 4, 2026, at 10:00 AM. The Tender ID is 2026_ISRO_838387_1, and the bid validity period is 120 days. There are no tender fees or EMD required for this tender. The empanelment aims to secure vendors capable of meeting ISRO's high-reliability standards for PCB wiring and assembly for its space-bound projects.