Flip Chip Bonding Services at CMTI for DRDO SSPL Delhi

Work Description - Flip Chip Bonding At Cmti

The Department of Defence Research and Development (DRDO), specifically through its Solid State Physics Laboratory (SSPL) located at Lucknow Road, Timarpur, Delhi, India, invites eligible and reputed bidders for the provision of "Flip Chip Bonding at CMTI" services. This tender, identified by Reference Number SPL/MMG/SBM/SPL168/C/26-27/006, seeks to procure essential services with a projected period of work spanning 600 days at the SSPL, Delhi location. The tender was e-published on 24-Jul-2026 at 05:30 PM, with document download and bid submission commencing from 24-Jul-2026 at 05:30 PM and 06:00 PM respectively. The crucial deadline for both document download and bid submission is 10-Aug-2026 at 02:00 PM, followed by the online bid opening on 11-Aug-2026 at 02:30 PM. Bidders are required to submit an Earnest Money Deposit (EMD) of ₹1,03,500, payable to the DIRECTOR, SSPL at DELHI, with an exemption option available, and can be submitted via Bankers Cheque, Bank Guarantee, Demand Draft, or FDR. There is no tender fee for this procurement. The bidding process involves two covers: one for Fee/Pre-qualification/Technical documents and the other for the financial bid, and all bids will remain valid for 180 days from the bid opening date. For complete details, including technical specifications and terms, prospective bidders are advised to refer to the official tender documents.