Department Of Defence Research And Development Tender

Work Description - Fabrication Support Service For Development Of Pic Component (batch Of 4 Wafer)

The Department of Defence Research and Development is inviting tenders for Fabrication Support Service for Development of PIC Component (Batch of 4 Wafer) under Tender Reference Number SSPL/MMG/DPP/SBM/B/R/25-26/126. This is a single-stage tender categorized as a service, with the successful contractor expected to provide services over a period of 480 days at SSPL, Delhi. The tender documents, including the RFP and BOQ, are available for download from 19-Jan-2026 05:30 PM until 04-Feb-2026 02:00 PM. Bids must be submitted electronically between 20-Jan-2026 03:00 PM and 04-Feb-2026 02:00 PM, and the bid opening is scheduled for 05-Feb-2026 02:30 PM. A substantial Earnest Money Deposit (EMD) of ₹12,16,500 is required, payable to DIRECTOR, SSPL in DELHI, which can be furnished through Bankers Cheque, Bank Guarantee, Demand Draft or FDR, and EMD exemption is allowed. Prospective bidders should carefully review the tender documents available online, including the RFP and BOQ, and submit their technical and financial bids in two separate covers as per the instructions provided. The first cover should contain the technical bid and the second cover should contain the financial bid as per the attached BOQ format.