Photolithography, Indium Deposition And Optimization Of Flip Chip Bonding

Work Description - Photolithography, Indium Deposition And Optimization Of Flip Chip Bonding

The Department of Defence Research and Development (DRDO), a Central Government Ministry/Department, invites tenders for "Photolithography, Indium Deposition and optimization of Flip Chip Bonding". This is a single-stage tender for the supply of goods, reference number SSPL/MMG/DPP/SBM/B/R/25-26/229. The tender documents can be downloaded from April 10, 2026, at 05:30 PM until April 23, 2026, at 02:00 PM. Bids must be submitted between April 10, 2026, at 06:00 PM and April 23, 2026, at 02:00 PM. The bid opening date is scheduled for April 24, 2026, at 02:30 PM and will be held online. An EMD of ₹6,96,200 is required, payable to DIRECTOR, SSPL, at DELHI, and EMD exemption is allowed through BG/ST. The tender documents, including the RFP and BOQ, are available for download. The successful bidder will be required to complete the work within 360 days, and the bid validity period is 180 days. The Tender Inviting Authority is KUNAL BHUSHAN, SR. STORES OFFICER-II, DRDO, SSPL, LUCKNOW ROAD, TIMARPUR, DELHI, INDIA, Pincode 110054. The required payment instruments are Bankers Cheque, Bank Guarantee, Demand Draft, and FDR. No Tender fee applicable.