Two-Year Preventive Maintenance for DRDO SSPL Delhi Wafer Surface Grinder

Work Description - Prive Maintenance For Wafer Surface Grinder

The Department of Defence Research and Development, a Central Government Ministry/Department, through its Tender Inviting Authority, Mr. Kunal Bhushan, Sr. Stores Officer-II (located at DRDO, SSPL, Lucknow Road, Timarpur, Delhi, India), invites bids for Tender ID 2026_DRDO_777273_1, Tender Reference Number SSPL/MMG/DPP/PBM/B/R/25-26/234. This tender is for the "Preventive Maintenance for Wafer Surface Grinder" at SSPL, Delhi, a service contract with a work period of 730 days. Key critical dates for interested applicants are as follows: Document Download Start Date is 08-Jul-2026 06:00 PM, with the download facility closing on 29-Jul-2026 02:00 PM. Bids can be submitted from 09-Jul-2026 03:00 PM until the Bid Submission End Date of 29-Jul-2026 02:00 PM. The technical bids will be opened online on 30-Jul-2026 at 02:30 PM. Applicants are required to submit an Earnest Money Deposit (EMD) of ₹1,27,300, payable to "DIRECTOR, SSPL" at DELHI. EMD submission through Bank Guarantee/ST or EMD exemption is allowed. There is no Tender Fee for this procurement. Bids must be submitted in two covers: Cover 1 (Fee/PreQual/Technical) containing documents as per S.NO.15 PART I(A) of the RFP, and Cover 2 (Finance) containing the price as per the attached BOQ format. Interested parties are advised to download all tender documents, including Tendernotice_1.pdf, RFP2526234.pdf, and BOQ_870508.xls, and adhere strictly to the submission guidelines.