Defence Research And Development Organization Tender

Work Description - 3 Inch Ingaas-inp Pin Wafers

The Department of Defence Research and Development, a Central Government Ministry, invites global tenders for the supply of 3 inch InGaAs-InP PiN Wafers. This tender, referenced as SSPL/MMG/DPP/GBM/B/R/25-26/159 with Tender ID 2026_DRDO_747173_1, is for the supply of goods with a contract form designated as 'Supply'. Interested parties can download tender documents starting January 5th, 2026, at 05:30 PM, with the download period ending on February 23rd, 2026, at 02:00 PM. Bids must be submitted between January 6th, 2026, at 03:00 PM and February 23rd, 2026, at 02:00 PM. The bid opening date is scheduled for February 24th, 2026, at 02:30 PM. An Earnest Money Deposit (EMD) of ₹1,95,400 is required, payable to the DIRECTOR, SSPL, and payable at DELHI, through Bankers Cheque, Bank Guarantee, Demand Draft, or FDR. Exemption from EMD may be allowed. The successful bidder is expected to deliver the wafers within 150 days, with the bid validity period being 180 days. Bidders should refer to the tender documents, including Tendernotice_1.pdf and RFP2526159.pdf, for detailed specifications and requirements. No tender fee is applicable. Bids should be submitted online in two covers: the first cover for Fee/PreQual/Technical documents as per S.NO. 17 PART I(A) of RFP Documents in .pdf format and the second cover containing the financial bid in .xls format as per the attached BOQ format. The Tender Inviting Authority is the SR. STORES OFFICER-II, located at DRDO, SSPL, LUCKNOW ROAD, TIAMRPURM DELHI, INDIA, Pincode 110054.