Ministry Of Education Tender

Work Description - Flip Chip Bonder

The Department of Higher Education, through the Assistant Registrar, MMD, IIT Bombay, invites open tenders for the procurement of a Flip Chip Bonder, to be installed at the Electrical Engineering Department, IIT Bombay. This tender, referenced as 6100002078, falls under the 'Goods' category, specifically targeting laboratory and scientific equipment. Key dates include a document download and bid submission deadline of April 30, 2025, at 01:00 PM, with the bid opening scheduled for April 30, 2025, at 04:00 PM. The tender process involves a two-cover system, requiring a Fee/PreQual/Technical bid in Cover 1 (.pdf format as per tender document) and a Financial bid in Cover 2 (.xls format). No tender fee or EMD is applicable. The successful bidder will be required to deliver the equipment within 30 days, and the bid validity period is 180 days. Interested parties can download the detailed tender documents, including technical specifications and the NIT, from the designated portal, starting April 1, 2025, at 04:30 PM.