Directorate General Of Medical And Cosmetic Tender
Goods
Input<TenderTitle> Supply of Desktop Computers<TenderOrganisation> XYZ Corporation<TenderWorkDescription> Supply and delivery of desktop computers for office use.Output Software and IT Solutions Electrical and Electronics
Flip Chip Bonder System
- Opening DateAug 14, 2025
- Closing DateSep 03, 2025
- Tender Amount Refer Document
Tender Overview
| Tender Title | Flip Chip Bonder System | ||
| Tender ID | GEM/2025/B/6568706 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2025-08-14 09:47 AM | Tender Closing Date | 2025-09-03 03:30 AM |
| Tender Value | Refer Document | Tender Location | NA , North Delhi , Delhi |
| Tender Category | Goods | Product Category | Input<Tender-Title> Supply of Desktop Computers<Tender-Organisation> XYZ Corporation<Tender-Work-Description> Supply and delivery of desktop computers for office use.Output Software and IT Solutions, Electrical and Electronics |
Tender Overview
- Tender TitleFlip Chip Bonder System
- Tender IDGEM/2025/B/6568706
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2025-08-14 09:47 AM
- Tender Closing Date2025-09-03 03:30 AM
- Tender Value Refer Document
- Tender LocationNA,North Delhi, Delhi
- Tender CategoryGoods
- Product CategoryInput<Tender-Title> Supply of Desktop Computers<Tender-Organisation> XYZ Corporation<Tender-Work-Description> Supply and delivery of desktop computers for office use.Output Software and IT Solutions, Electrical and Electronics
Important Dates
| ePublished Date | 2025-08-13 06:30 PM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2025-08-14 09:47 AM | Bid Submission End Date | 2025-09-03 03:30 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
Important Dates
- ePublished Date 2025-08-13 06:30 PM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2025-08-14 09:47 AM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
The Department of Defence Research and Development, under the Ministry of Defence, invites bids for the procurement of one unit of a Flip Chip Bonder System. This tender, issued by the Office of DG (Med Cos) and bearing bid number GEM/2025/B/6568706, seeks to acquire a critical piece of equipment to enhance research and development capabilities. The deadline for bid submissions is September 3rd, 2025, at 9:00 AM, with the bidding window opening on August 14th, 2025, at 3:17 PM. Prospective bidders are advised to review all tender documents carefully and adhere to the specified requirements to ensure a compliant and competitive submission. This procurement aims to modernize existing infrastructure and support advanced research initiatives within the Department of Defence Research and Development.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
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