Defence Research And Development Organisation Tender

Work Description - Sic Wafers

The Department of Defence Research and Development is inviting global tenders for the supply of SiC Wafers, as detailed in Tender Reference Number SSPL/MMG/DPP/GBM/B/R/25-26/068. Interested parties can download tender documents starting from August 14, 2025, at 05:30 PM, with the deadline for document download and bid submission set for September 15, 2025, at 02:00 PM. A fixed Earnest Money Deposit (EMD) of ₹64,850 is required, payable to the DIRECTOR, SSPL, in DELHI, through Bankers Cheque, Bank Guarantee, Demand Draft, or FDR, with EMD exemption allowed under specific conditions. The bid opening is scheduled for September 16, 2025, at 02:30 PM online. The tender process involves a two-cover system, with the first cover containing Fee/PreQual/Technical documents and the second cover encompassing the financial bid as per the attached BOQ format; all documents should be submitted according to the instructions in the RFP documents. This tender falls under the 'Goods' category, with a contract form of 'Supply,' and prospective bidders must adhere to the bid validity period of 180 days and a period of work of 150 days, as specified in the tender documents. The Tender Inviting Authority is SUNIL KUMAR SINGH, SR. STORES OFFICER-II, located at DRDO, SSPL, LUCKNOW ROAD, TIMARPUR, DELHI, INDIA. No tender fee is applicable for this tender.