Bondline Stress and Strain Sensor System with Data Acquisition and Software for Defence R&D
- Opening DateSep 05, 2026
- Closing DateSep 07, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Bondline Stress and Strain Sensor System with Data Acquisition and Software for Defence R&D | ||
| Tender ID | GEM/2026/B/7389088 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-09-05 12:00 PM | Tender Closing Date | 2026-09-07 12:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Pune , Maharashtra |
| Tender Category | Goods | Product Category | Electrical and Electronics Tenders, Electronics Equipment Tenders, Software and IT Solutions Tenders |
- Tender TitleBondline Stress and Strain Sensor System with Data Acquisition and Software for Defence R&D
- Tender IDGEM/2026/B/7389088
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-09-05 12:00 PM
- Tender Closing Date2026-09-07 12:00 PM
- Tender Value Refer Document
- Tender LocationNA,Pune, Maharashtra
- Tender CategoryGoods
- Product CategoryElectrical and Electronics Tenders, Electronics Equipment Tenders, Software and IT Solutions Tenders
Important Dates
| ePublished Date | 2026-05-06 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-09-05 12:00 PM | Bid Submission End Date | 2026-09-07 12:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-05-06 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-09-05 12:00 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
**Tender Description for Bondline Stress and Strain Sensors with Data Acquisition, Device and Software** This tender opportunity is issued by the Department of Defence Research & Development, operating under the Ministry of Defence. The procurement, identified by Bid Number GEM/2026/B/7389088, is being managed by the Office of the Director General (ACE) and is specifically for the supply of a single unit of Bondline Stress and Strain Sensors with Data Acquisition Device and Software, conforming to detailed specifications. The bidding period will commence on 05-09-2026 at 12:00 PM and conclude on 07-09-2026 at 12:00 PM. This vital procurement, dated 06-05-2026, is essential for supporting research and development activities within the Pune City region. Interested parties are invited to submit their proposals within the specified timeframe.
Ready to Take Your Business to the Next level ?
Get Hassle free financing for your business
Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
Secure Your Projects with Tender Material & Financing
- Secure competitive project proposals.
- Strategic funding solutions to drive your projects to success.
Tenders with Similar Requirements
National Automotive Board Tender
Crash Designer Software Upgrade: Supply, Install, Test, Commission..read more
Office Of Director General Tender
Non-Verbal Data Acquisition System for Defence Research..read more
Indian Institute Of Technology Tender
IIT Roorkee Procurement: Data Acquisition Device with Chassis Supply..read more
National Institute Of Technology Tender
National Institute of Technology Jalandhar: USB Data Acquisition Card Procurement..read more
Geological Survey Of India Tender
Iolite Data Reduction Software Procurement and Support for Geological Survey of..read more
National Automotive Board Tender
Office Of Director General Tender
Indian Institute Of Technology Tender
National Institute Of Technology Tender
Geological Survey Of India Tender
Wide Range of Brands
All the major brands in each raw material category
