| Tender Title | Supply of Five Types of Printed Circuit Board (PCB) Assemblies for Defence Manufacturing | ||
| Tender ID | GEM/2026/B/8157646 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-10-14 09:57 AM | Tender Closing Date | 2026-11-04 10:00 AM |
| Tender Value | Refer Document | Tender Location | NA , Hyderabad , Telangana |
| Tender Category | NA | Product Category | Electrical and Electronics Tenders, Electronics Equipment Tenders |
| ePublished Date | 2026-10-14 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-10-14 09:57 AM | Bid Submission End Date | 2026-11-04 10:00 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Work Description - NA
This tender presents a significant opportunity for qualified suppliers to provide essential components to the Department of Defence Production, under the Ministry of Defence. Hindustan Aeronautics Limited (HAL) is issuing this bid (Bid Number: GEM/2026/B/8157646) for the supply of a critical requirement: five distinct types of Printed Circuit Board (PCB) Assemblies. The total quantity sought is 270 units, encompassing item categories 149655-1, 149659-1, 149683-1, 149684-1, and 149685-1. The bidding period commences on 14-10-2026 at 9:57 AM and concludes on 04-11-2026 at 10:00 AM. This tender, dated 14-10-2026, originates from HAL's operational base in Rangareddi and represents a vital procurement for national defence manufacturing.

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| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
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