| Tender Title | Supply of ENDBearing Pads (EBP) with Punching, Deburring, and Cleaning Services | ||
| Tender ID | GEM/2026/B/7684816 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-10-10 01:00 PM | Tender Closing Date | 2026-10-13 01:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Hyderabad , Telangana |
| Tender Category | Goods | Product Category | Construction Material Tenders, Machinery and Tools Tenders |
| ePublished Date | 2026-06-30 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-10-10 01:00 PM | Bid Submission End Date | 2026-10-13 01:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | ₹ 2,82,880 |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Work Description - NA
This tender, identified by Bid Number GEM/2026/B/7684816, is issued by the Directorate of Purchase and Stores, under the Department of Atomic Energy, and is facilitated by the PMO. Dated 30-06-2026, this procurement opportunity pertains to the punching, coining, deburring, cleaning, and supply of ENDBearing Pads (EBP) as detailed in the attached annexure. The total quantity required is 3,200,000 units. Interested bidders can submit their proposals between 1:00 PM on 10-10-2026 and 1:00 PM on 13-10-2026. An Earnest Money Deposit (EMD) of ₹282,880.00 is mandatory for participation. The tendering process will be managed by the Directorate of Purchase and Stores, located at 500062 HRPSU NFC P.O. ECIL.

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| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
For Complete Deion And Other Details, Please Refer To Tender
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