Procurement of Advanced Die Bonder and Wedge/Ball Bonder for IIT
- Opening DateSep 29, 2026
- Closing DateOct 20, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Procurement of Advanced Die Bonder and Wedge/Ball Bonder for IIT | ||
| Tender ID | GEM/2026/B/8097318 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-09-29 06:25 PM | Tender Closing Date | 2026-10-20 07:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Gandhi Nagar , Gujarat |
| Tender Category | Goods | Product Category | Machinery and Tools Tenders |
- Tender TitleProcurement of Advanced Die Bonder and Wedge/Ball Bonder for IIT
- Tender IDGEM/2026/B/8097318
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-09-29 06:25 PM
- Tender Closing Date2026-10-20 07:00 PM
- Tender Value Refer Document
- Tender LocationNA,Gandhi Nagar, Gujarat
- Tender CategoryGoods
- Product CategoryMachinery and Tools Tenders
Important Dates
| ePublished Date | 2026-09-29 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-09-29 06:25 PM | Bid Submission End Date | 2026-10-20 07:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-09-29 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-09-29 06:25 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | ₹ 1,68,000 |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender, identified by Bid Number GEM/2026/B/8097318, is being issued by the Indian Institute of Technology (IIT), under the Department of Higher Education and Ministry of Education. The tender is for the procurement of a Die Bonder and Wedge and Ball Bonder, with a total quantity of one unit. The bidding period commences on 29-09-2026 at 6:25 PM and concludes on 20-10-2026 at 7:00 PM. A Earnest Money Deposit (EMD) of ₹168,000.0 is required. This opportunity, dated 29-09-2026, originates from the IITGN MM office and presents a critical requirement for advanced bonding equipment within the higher education sector.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
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