SMD and Through-Hole PCB Assembly Services for Combined Units
- Opening DateOct 15, 2026
- Closing DateNov 05, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | SMD and Through-Hole PCB Assembly Services for Combined Units | ||
| Tender ID | GEM/2026/B/8164188 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-10-15 11:58 AM | Tender Closing Date | 2026-11-05 12:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Mohali , Punjab |
| Tender Category | Services | Product Category | Electrical and Electronics Tenders |
- Tender TitleSMD and Through-Hole PCB Assembly Services for Combined Units
- Tender IDGEM/2026/B/8164188
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-10-15 11:58 AM
- Tender Closing Date2026-11-05 12:00 PM
- Tender Value Refer Document
- Tender LocationNA,Mohali, Punjab
- Tender CategoryServices
- Product CategoryElectrical and Electronics Tenders
Important Dates
| ePublished Date | 2026-10-15 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-10-15 11:58 AM | Bid Submission End Date | 2026-11-05 12:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-10-15 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-10-15 11:58 AM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender opportunity is issued by the Semiconductor Laboratory, operating under the Department of Electronics and Information Technology, Ministry of Electronics and Information Technology. With Bid Number GEM/2026/B/8164188, this procurement aims to secure comprehensive job work services for the Surface Mount Device (SMD) and Through-Hole (Thu-Holed) assembly of a combined unit Printed Circuit Board (PCB). The scope of work encompasses the assembly of a total quantity of 150 such units. Interested parties are invited to submit their bids, with the bidding period commencing on October 15, 2026, at 11:58 AM and concluding on November 5, 2026, at 12:00 PM. The Semiconductor Laboratory is located at 160071, Sector 72, S.A.S Nagar, Mohali.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
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