Supply of Wafer Cleaning System Top Cover Assembly Spare Part
- Opening DateOct 27, 2026
- Closing DateNov 17, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Supply of Wafer Cleaning System Top Cover Assembly Spare Part | ||
| Tender ID | GEM/2026/B/8202618 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-10-27 04:44 PM | Tender Closing Date | 2026-11-17 05:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Mohali , Punjab |
| Tender Category | Goods | Product Category | Machinery and Tools Tenders, Electronics Equipment Tenders |
- Tender TitleSupply of Wafer Cleaning System Top Cover Assembly Spare Part
- Tender IDGEM/2026/B/8202618
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-10-27 04:44 PM
- Tender Closing Date2026-11-17 05:00 PM
- Tender Value Refer Document
- Tender LocationNA,Mohali, Punjab
- Tender CategoryGoods
- Product CategoryMachinery and Tools Tenders, Electronics Equipment Tenders
Important Dates
| ePublished Date | 2026-10-27 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-10-27 04:44 PM | Bid Submission End Date | 2026-11-17 05:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-10-27 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-10-27 04:44 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | ₹ 30,450 |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender seeks the supply of a critical spare part for semiconductor fabrication equipment. The Department of Electronics and Information Technology, through the Semiconductor Laboratory, located at 160071 SECTOR 72 S.A.SNAGAR MOHALI, is issuing Bid Number GEM/2026/B/8202618 for the procurement of one unit of the "Top cover assembly PN-S0977-0201-000-01", which is a vital spare for their Wafer cleaning system (Model 977). The tender commenced on 27-10-2026 at 4:44 PM and will close on 17-11-2026 at 5:00 PM. An Earnest Money Deposit (EMD) of ₹30,450.00 is required from prospective bidders. This procurement falls under the purview of the Ministry of Electronics and Information Technology, aiming to ensure the continued operational efficiency of essential semiconductor manufacturing infrastructure.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
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