Supply of Electronic Sealing Lids with Preforms for Semiconductor Applications

This tender, identified by Tender Reference Number SCL/PS/45207/VAHD/2026 and Tender ID 2026_SCL_929230_1, is issued by the Semi-Conductor Laboratory (SCL), a Central Government Ministry/Department, for the supply of "Sealing Lid with preform (LWP) 414 mils x 360 mils ID 363 mils x 308 mils". The procurement falls under the "Goods" category, specifically "Electronic Components And Devices". The tender requires a two-cover system, with the first cover encompassing Tender Acceptance Letter, compliance to commercial terms and conditions, and compliance to drawings and material specifications, while the second cover is designated for the financial bid (BOQ). The bid submission period commences on October 13, 2026, at 11:30 AM and concludes on November 3, 2026, at 11:00 AM, with the bid opening scheduled for November 4, 2026, at 03:30 PM at the Semi Conductor Laboratory. The Earnest Money Deposit (EMD) is fixed at ₹18,600, payable to Semi-Conductor Laboratory (SCL), with options for EMD exemption through BG/ST. There is no tender fee associated with this procurement. The bid validity is set at 180 days. Potential bidders are advised to carefully review the downloaded tender documents, including Annexure I (Drawings) and Annexure II (Material Specification), for detailed technical requirements and compliance expectations.