Indian Army Procurement of Advanced 3D Printer Component Assemblies
- Opening DateOct 13, 2026
- Closing DateOct 23, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Indian Army Procurement of Advanced 3D Printer Component Assemblies | ||
| Tender ID | GEM/2026/B/8153532 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-10-13 02:32 PM | Tender Closing Date | 2026-10-23 03:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Others , Others |
| Tender Category | Goods | Product Category | Electrical and Electronics Tenders, Electronics Equipment Tenders |
- Tender TitleIndian Army Procurement of Advanced 3D Printer Component Assemblies
- Tender IDGEM/2026/B/8153532
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-10-13 02:32 PM
- Tender Closing Date2026-10-23 03:00 PM
- Tender Value Refer Document
- Tender LocationNA,Others, Others
- Tender CategoryGoods
- Product CategoryElectrical and Electronics Tenders, Electronics Equipment Tenders
Important Dates
| ePublished Date | 2026-10-13 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-10-13 02:32 PM | Bid Submission End Date | 2026-10-23 03:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-10-13 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-10-13 02:32 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender is being issued by the Department of Military Affairs, under the Ministry of Defence, on behalf of the Indian Army. The bid, identified by GEM/2026/B/8153532, is for the procurement of critical components essential for advanced manufacturing and operational readiness. The specific items required include Thermistor Sensors, Heated Beds for print adhesion, Filament Sensors, Cooling Fans, Power Supply Units (PSUs), and Display Screens. A total quantity of six units of this comprehensive assembly is being sought. Interested and qualified vendors are invited to submit their bids, which will be accepted from 13-10-2026 at 2:32 PM until 23-10-2026 at 3:00 PM. Further details regarding technical specifications, delivery schedules, and evaluation criteria will be made available within the complete tender document.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
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