Procurement of Semi-Automatic Wire Bonder for Scientific Research
- Opening DateOct 09, 2026
- Closing DateOct 30, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | Procurement of Semi-Automatic Wire Bonder for Scientific Research | ||
| Tender ID | GEM/2026/B/8140576 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-10-09 05:57 PM | Tender Closing Date | 2026-10-30 06:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Indore , Madhya Pradesh |
| Tender Category | Goods | Product Category | Machinery and Tools Tenders |
- Tender TitleProcurement of Semi-Automatic Wire Bonder for Scientific Research
- Tender IDGEM/2026/B/8140576
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-10-09 05:57 PM
- Tender Closing Date2026-10-30 06:00 PM
- Tender Value Refer Document
- Tender LocationNA,Indore, Madhya Pradesh
- Tender CategoryGoods
- Product CategoryMachinery and Tools Tenders
Important Dates
| ePublished Date | 2026-10-09 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-10-09 05:57 PM | Bid Submission End Date | 2026-10-30 06:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-10-09 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-10-09 05:57 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
Tender Description for Semi-Automatic Wire Bonder
This tender, bid number GEM/2026/B/8140576, is being issued by the University Grants Commission (UGC), operating under the Ministry of Education and specifically within the Department of Higher Education. The tender pertains to the procurement of one (1) Semi-Automatic Wire Bonder. This critical piece of equipment is intended for the UGC Dae Consortium for Scientific Research, highlighting its importance for advanced scientific endeavors. The bidding period commences on October 9, 2026, at 5:57 PM and concludes on October 30, 2026, at 6:00 PM. Prospective suppliers are invited to submit their proposals for this vital acquisition, which will significantly contribute to the research capabilities of the designated institution.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
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