2-Layer Printed Circuit Board Fabrication for c-DAC Initiatives
- Opening DateSep 02, 2026
- Closing DateSep 12, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | 2-Layer Printed Circuit Board Fabrication for c-DAC Initiatives | ||
| Tender ID | GEM/2026/B/7987694 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-09-02 02:09 PM | Tender Closing Date | 2026-09-12 03:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Thiruvananthapuram , Kerala |
| Tender Category | Goods | Product Category | Electrical and Electronics Tenders, Electronics Equipment Tenders |
- Tender Title2-Layer Printed Circuit Board Fabrication for c-DAC Initiatives
- Tender IDGEM/2026/B/7987694
- Tender Reference NumberNA
- Tender TypeNA
- Tender Opening Date2026-09-02 02:09 PM
- Tender Closing Date2026-09-12 03:00 PM
- Tender Value Refer Document
- Tender LocationNA,Thiruvananthapuram, Kerala
- Tender CategoryGoods
- Product CategoryElectrical and Electronics Tenders, Electronics Equipment Tenders
Important Dates
| ePublished Date | 2026-09-02 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-09-02 02:09 PM | Bid Submission End Date | 2026-09-12 03:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
- ePublished Date 2026-09-02 12:00 AM
- Bid Opening Date
- Document Download Start Date
- Document Download End Date
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-09-02 02:09 PM
- Bid Validity Period (in Days)NA
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Tender Description
Work Description - NA
This tender is issued by the Centre For Development Of Advanced Computing (c-DAC), a key organization under the Ministry of Electronics and Information Technology, with its procurement department located at Vellayambalam, Thiruvananthapuram (PIN 695033). The bid, referenced as GEM/2026/B/7987694 and dated September 2, 2026, opens for submission on September 2, 2026, at 2:09 PM and closes on September 12, 2026, at 3:00 PM. The primary scope of this tender involves the fabrication of a total quantity of 936 units, specifically encompassing 2-layer Printed Circuit Boards (PCBs) designated as 86A, 87A, and 88A. This procurement opportunity is critical for supporting the Department of Electronics and Information Technology's ongoing initiatives.
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Tender Contact Details
| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
Document
specification_pcb_86a_2026-09-02-13-59-20_561b50dd95a72a7c661e95e15aa20570.pdfDocument
specification_pcb_87a_2026-09-02-14-00-52_88892e04251f0ab8a2dc50864dc5bd32.pdfDocument
specification_pcb_88a_2026-09-02-14-01-51_6e631ebd1516a193eae6174622097ef5.pdfDocument
GeM-Bidding-9836898.pdfDocument
ATC_4be01620-0933-41b2-a78b1788338291294_buycon15.cdacc.kl@gembuyer.in.pdf
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