Multilayer Rigid-Flex PCB Fabrication and Supply for Space and Ground Applications

Goods
Electrical and Electronics
+ 1
Electronics Equipment
  • Opening DateNov 04, 2026
  • Closing DateDec 01, 2026
  • Tender Amount Refer Document

Tender Overview

Tender Title Multilayer Rigid-Flex PCB Fabrication and Supply for Space and Ground Applications
Tender ID2026_ISRO_856192_1Tender Reference NumberSAC/CPUR/SA202600193701
Tender TypeGlobal Tenders
Tender Opening Date2026-11-04 11:00 AMTender Closing Date2026-12-01 03:30 PM
Tender Value Refer Document Tender LocationSac Ahmedabad , Ahmedabad , Gujarat
Tender CategoryGoodsProduct CategoryElectrical and Electronics Tenders, Electronics Equipment Tenders
Tender Overview
  • Tender TitleMultilayer Rigid-Flex PCB Fabrication and Supply for Space and Ground Applications
  • Tender ID2026_ISRO_856192_1
  • Tender Reference NumberSAC/CPUR/SA202600193701
  • Tender TypeGlobal Tenders
  • Tender Opening Date2026-11-04 11:00 AM
  • Tender Closing Date2026-12-01 03:30 PM
  • Tender Value Refer Document
  • Tender LocationSac Ahmedabad,Ahmedabad, Gujarat
  • Tender CategoryGoods
  • Product CategoryElectrical and Electronics Tenders, Electronics Equipment Tenders

Important Dates

ePublished Date 2026-11-04 11:00 AM Bid Opening Date2026-12-01 04:30 PM
Document Download Start Date2026-11-04 11:00 AMDocument Download End Date2026-12-01 03:30 PM
Bid Submission Start Date2026-11-04 11:00 AMBid Submission End Date2026-12-01 03:30 PM
Clarification start DateClarification End Date
Bid Validity Period (in Days)120
Important Dates
  • ePublished Date 2026-11-04 11:00 AM
  • Bid Opening Date2026-12-01 04:30 PM
  • Document Download Start Date2026-11-04 11:00 AM
  • Document Download End Date2026-12-01 03:30 PM
  • Clarification End Date
  • Clarification End Date
  • Bid Submission Start Date2026-11-04 11:00 AM
  • Bid Validity Period (in Days)120

Cost Specification

Tender Fee Refer document
EMD (Earnest Money Deposit) Refer document
EMD Fee Type Fixed
Payment Instruments/Mode Not Applicable

Tender Description

Work Description - Fabrication And Supply Of Multilayer Rigid-flex Pcbs (ground And Space Applications)

This tender, referenced as SAC/CPUR/SA202600193701, is being issued by the Indian Space Research Organisation (ISRO) through its Procurement Officer (PSO) at SAC Ahmedabad. The subject of this global tender, categorized under Goods and specifically within Electronics Equipment, is the "FABRICATION AND SUPPLY OF MULTILAYER RIGID-FLEX PCBs (GROUND AND SPACE APPLICATIONS)". Interested parties are invited to download the tender documents starting from 04-Nov-2026 at 11:00 AM, with the download facility closing on 01-Dec-2026 at 03:30 PM. Bids can be submitted commencing on 04-Nov-2026 at 11:00 AM, and the final deadline for bid submission is 01-Dec-2026 at 03:30 PM. The bid opening is scheduled for 01-Dec-2026 at 04:30 PM. Notably, there is no tender fee or Earnest Money Deposit (EMD) required for this procurement.

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Tender Contact Details

Office Inviting Bids Pso
AddressSac Ahmedabad
Contact Details NA
Email NA
Website NA

Documents

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