976nm Laser Chip Fabrication and Epi-Wafer Processing Services
- Opening DateOct 02, 2026
- Closing DateOct 15, 2026
- Tender Amount Refer Document
Tender Overview
| Tender Title | 976nm Laser Chip Fabrication and Epi-Wafer Processing Services | ||
| Tender ID | 2026_DRDO_792120_1 | Tender Reference Number | SSPL/MMG/DPP/SBM/B/R/26-27/094 |
| Tender Type | Single | ||
| Tender Opening Date | 2026-10-02 03:00 PM | Tender Closing Date | 2026-10-15 02:00 PM |
| Tender Value | Refer Document | Tender Location | Sspl, Delhi , North Delhi , Delhi |
| Tender Category | Services | Product Category | Electronics Equipment Tenders |
Tender Overview
- Tender Title976nm Laser Chip Fabrication and Epi-Wafer Processing Services
- Tender ID2026_DRDO_792120_1
- Tender Reference NumberSSPL/MMG/DPP/SBM/B/R/26-27/094
- Tender TypeSingle
- Tender Opening Date2026-10-02 03:00 PM
- Tender Closing Date2026-10-15 02:00 PM
- Tender Value Refer Document
- Tender LocationSspl, Delhi,North Delhi, Delhi
- Tender CategoryServices
- Product CategoryElectronics Equipment Tenders
Important Dates
| ePublished Date | 2026-10-01 05:10 PM | Bid Opening Date | 2026-10-16 02:30 PM |
| Document Download Start Date | 2026-10-01 05:30 PM | Document Download End Date | 2026-10-15 02:00 PM |
| Bid Submission Start Date | 2026-10-02 03:00 PM | Bid Submission End Date | 2026-10-15 02:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | 180 |
Important Dates
- ePublished Date 2026-10-01 05:10 PM
- Bid Opening Date2026-10-16 02:30 PM
- Document Download Start Date2026-10-01 05:30 PM
- Document Download End Date2026-10-15 02:00 PM
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2026-10-02 03:00 PM
- Bid Validity Period (in Days)180
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | |
| EMD Fee Type | Fixed |
| Payment Instruments/Mode | Offline |
Tender Description
Work Description -
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Tender Contact Details
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