Ground Levelling and Dust/Stone Chip Filling for Bathukamma Festival Locations

This tender, referenced as 05/EE-III/GWMC/CTN/13/eProcurement/2026-27, Dt:05-10-2026, is issued by the Information Technology Electronics and Communication Department Telangana, on behalf of the Executive Engineer, Commissioner, GWMC, for the "Levelling of ground Supply and Filling of Dust and Stone Chips various locations in Dicvision No.53 and 54 for Bathukamma Festival 2026-27". This is an open/advertised tender categorized under "Works" with a specific focus on "Civil Works" and is to be executed across various locations within Division No.53 and 54. Bidders are required to pay a tender fee of ₹128 and submit an Earnest Money Deposit (EMD) of ₹3600. The tender documents will be available for download from October 7, 2026, at 9:00 PM, and bidding will open on October 13, 2026, at 4:01 PM, with the submission deadline for bids also set for October 13, 2026, at 4:00 PM. The ePublished Date for this tender is October 7, 2026, at 8:58 PM, and the document download concludes on October 13, 2026, at 4:00 PM.