| Tender Title | Procurement of Semi-Automatic Wire Bonder for Scientific Research | ||
| Tender ID | GEM/2026/B/8230392 | Tender Reference Number | NA |
| Tender Type | NA | ||
| Tender Opening Date | 2026-11-02 05:06 PM | Tender Closing Date | 2026-11-23 06:00 PM |
| Tender Value | Refer Document | Tender Location | NA , Indore , Madhya Pradesh |
| Tender Category | Goods | Product Category | NA |
| ePublished Date | 2026-11-02 12:00 AM | Bid Opening Date | |
| Document Download Start Date | Document Download End Date | ||
| Bid Submission Start Date | 2026-11-02 05:06 PM | Bid Submission End Date | 2026-11-23 06:00 PM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | NA |
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | Refer document |
| EMD Fee Type | NA |
| Payment Instruments/Mode | NA |
Work Description - NA
Tender for the Procurement of a Semi-Automatic Wire Bonder
The University Grants Commission (UGC), under the aegis of the Ministry of Education, Department of Higher Education, is pleased to announce a tender opportunity for the acquisition of a single Semi-Automatic Wire Bonder. This procurement is being managed by the UGC Dae Consortium for Scientific Research. The tender, identified by Bid Number GEM/2026/B/8230392, will officially open for submissions on November 2, 2026, at 5:06 PM and will close promptly at 6:00 PM on November 23, 2026. Interested parties are invited to review the detailed specifications and submit their proposals within this stipulated timeframe. This initiative underscores the UGC's commitment to enhancing scientific research infrastructure within higher education institutions across the nation.

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| Office Inviting Bids | NA |
| Address | NA |
| Contact Details | NA |
| NA | |
| Website | NA |
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