Custom ASIC Design, Tapeout, Packaging, and Testing for Cochlear Implant Unit

This tender invitation is issued by the Centre For Development Of Advanced Computing (c-dac), operating under the Department Of Electronics And Information Technology, for a critical project identified by Bid Number GEM/2026/B/8055705. The scope of work encompasses the complete lifecycle of a custom ASIC, specifically for the implant unit of a cochlear implant. This includes design, tapeout, packaging, and testing, signifying a high-precision engineering requirement. The procurement is being managed by the Purchase Department at their Vellayambalam facility in Thiruvananthapuram, and the relevant Ministry is the Ministry Of Electronics And Information Technology. Interested parties are advised that the bidding period commences on 21-09-2026 at 10:48 AM and concludes sharply on 09-10-2026 at 6:00 PM. This single-item procurement, with a total quantity of one, represents a significant opportunity for specialized vendors in the field of advanced semiconductor design and manufacturing.