High-Performance FPGA Heat Sink Supply for Artix-7 and Kintex-7 Devices

Work Description - NA

This tender seeks to procure a substantial quantity of **2400 high-performance heat sinks** for Artix-7 and Kintex-7 FPGAs from the Department of Telecommunications (DOT), an entity falling under the Ministry of Communications, with ITI Limited, Bangalore serving as the office of issue. Specifically, the requirement is for two distinct types of heat sinks: **MaxiFlow heat sinks with thermal tape attachment** designed for Artix-7 FPGAs, and **MaxiFlow cross-cut high-performance heat sinks with hardware attachment** for Kintex-7 FPGAs. This procurement, identified by Bid Number GEM/2026/B/8000999, is open for bidding from September 5, 2026, 4:00 PM, and closes on September 26, 2026, at 6:00 PM. Bidders are invited to submit their proposals for the supply of these critical components to ITI Ltd, Doorvaninagar, Bangalore (PIN 560016), ensuring adherence to the specified performance and attachment requirements for optimal thermal management of these advanced FPGA devices.