Defence Research And Development Organisation Tender

Work Description - Automatic Wafer Dicing Machine

The Department of Defence Research and Development (DRDO), a Central Government Ministry/Department, invites global tenders for the procurement of an Automatic Wafer Dicing Machine. This tender, referenced as SPL/GEM/BU/C/24-25/277 and Tender ID 2025_DRDO_742704_1, is for a supply contract with a work period of 120 days and a bid validity of 180 days. The tender documents, including the RFP and BOQ, are available for download from December 4th, 2025, until January 5th, 2026, at 2:00 PM. Bids must be submitted electronically, with the submission window opening on December 5th, 2025, at 3:00 PM and closing on January 5th, 2026, at 2:00 PM. A substantial Earnest Money Deposit (EMD) of ₹9,00,000 is required, payable to DIRECTOR, SSPL in DELHI via Bankers Cheque, Bank Guarantee, Demand Draft or FDR with exemptions considered. The bid opening will occur online on January 6th, 2026, at 2:30 PM. Interested parties should refer to the tender documents for complete details, including technical specifications and submission requirements, located at SSPL, LUCKNOW ROAD, TIMARPUR, DELHI, INDIA Pincode 110054. There is no Tender Fee required for submission.